ROADMs and Optical Switches

Devoted to offering help the power is managed, leading supplier’s American high American company full of trees of the safe, reliable and high-performance semiconductor technological products Microsemi Corporation, the code of New York Nasdaq exchange: MSCC Introduce one the intersection of lighting and lamps and lanterns and optimize can adjust luminance LED driver module while being new to the intersection of all parts of the world and house, commerce and industry. 30W LXMG221W-0700030-D0

International solid circuit seminar ISSCC2012 held this week Have, imec and auspicious Sa electronic Corporation hereafter referred to as ” The auspicious Sa electron ” Have introduced innovative SAR-ADC the comparison modulus converter one by one ,Promote efficiency and speed by a wide margin, face the wireless receiver which accords with the standard requirement of high bandwidth of new generation, such as LTE-advanced and new developing Wi-Fi IEEE802.11ac .

SAR ADC that imec and auspicious Sa electron develop

SAR ADC has with high efficiency and with small and exquisite appearance characteristics, it is extremely attractive to various wireless applications thus should build up to let. SAR ADC is a first-selected framework of those application with medium-sized resolution ratio and sampling frequency. However, accord with the high bandwidth standard of new generation such as LTE-advanced and Wi-Fi of new generation ADC that the wireless receiver need that is required is with higher speed. Such new SAR ADC framework was developed cooperatively by imec and auspicious Sa electron, had met the demand for faster small-scale low consumption ADC. ADC introduced newly is a section of ultralow consumption 1.7mW , high-resolution 11 , the whole trends, two the intersection of step and type interweave the intersection of assembly line and SAR ADC, realize record-breaking high-energy result – change the intersection of step and 10fJ each time under up to 250Msps the intersection of sample and speed. It has promoted speed and sampling frequency by a wide margin, it is order of magnitude higher than the existing advanced ADC IP module.

This was realized through the new converter framework based on that imec previous innovative ADC design, have caught the opportunity that modern advanced CMOS technology creates ingeniously. Design and adopt all dynamic circuit, in this way the consumption is presented and changed the relation with sampling frequency linearly, having realized digitization to the maximum extent, the comparator is the module of only simulation.

ADC prototype adopted 40nm CMOS craft to make, the key chip area was square 0.066 millimetre. Measure and reveal DNL the error sharply type of differential With INL the error sharply type of total mark It is respectively 0.8 /-0.5 and 1.1 /-1.5 LSB. Dynamic performance has been shown as and realized SNDR 10.0 ENOB of 62dB under the speed of 10Msps ,But can keep the level of 9.5 ENOB under the sample speed up to 250Msps. The consumption is 6.9pJ / conversion 70

Global wired and wireless communication semiconductor innovative leader of solution rich and coherent Broadcom Company Nasdaq: BRCM Announce, putting out global 100GbE supreme in density exchanges the solution series BCM88650, this series of products can realize the high density exchanges the design of platform, realize up to 4000 100GbE ports. BCM88650 form chip system SoC Have the integrated level with supreme industry, have integrated the overall line card function in the single chip. BCM88650 SoC and rich and open and leading FE1600BCM88750 Exchange matrix together, can realize the speed exceeds the high density network solution of new generation of 100Tbps.

With the popularization day by day of social network, flow media and large bandwidth commercial service, the demand for higher speed network is increasing at the surprising speed. So, can expand and exchange the key requirement for the infrastructure as a new generation in the economical and practical 100GbE platform. The large-scale data centres of thousands of servers need the high density core with 100Gbps interface to exchange the platform, in order to support enhanced access ability day by day such as 10G PON. Series BCM88650 are only commercial chip solutions that can 200Gbps flow flows between second floor and single yard of fourth floor of treatment, this series have integrated the advanced bag to classify and buffer the function of management of the flow deeply, in order to support data centre and operator’s Ethernet and meet and divide into groups to transmit the requirement.

The analysts are expected, 100GbE technology, in the first year when put out, the growth rate will exceed 40GbE notably. 40G has served as the pioneer of 100G in many aspects, has reduced one grade of risks of assembly, make operator and test apparatus manufacturer familiar with the relevant network 1.

The unparalleled integrated level can reduce the circuit board size, reduce consumption and systematic cost

BCM88650 unparalleled integrated level enables apparatus manufacturer to reduce the circuit board size, reduce the consumption, reduce the systematic cost at the same time. The unified framework enables system manufacturer to develop one to adopt and exchange the framework in but the expansion product line the samely, in order to meet the demands of different density and application.

The total capacity inserts and exchanges the solution to adopt the single BCM88650 device to be designed for the operator of several hundred Gbps. Can also design, suitable for the intersection of data and the intersection of centre and key network or the intersection of operator and key network, machine case with total capacity of 25Tbps with BCM88650. In addition, all right interconnection of a plurality of machine cases of different capacity, in order to put up an expanded key platform, and offer up to 4000 pieces of 100GbE line speed port or 40GbE/10GbE port of the corresponding quantity.

The driving force of the market:

By 2016, the global IP flow is expected to increase by 20 point 1 times;

By 2015, the video content will convey 1 across the network to have 1 million minutes every second;

By 2015, the apparatus quantity connected to IP network will reach 2 point 1 times of the global size of population;

Considerable growth of flow give existing the intersection of network and framework bring challenges 3;

By 2015, the income of GbE is expected to reach about 50 billion dollars on 10/40/100.

Products main point:

A few days ago, unite core science and technology at its 2012 customer’s conference, introduce TD-LTE/LTE FDD/TD-HSPA/GGE many mould chip LC1761 and TD-LTE/LTE FDD bimodulus baseband chips LC1761L. The first for the industry at present of two sections of chips supports the hardware to accelerate the algorithm that ZUC grandfather washed at the same time, LTE terminal chip of 3GPP Release 9 and LTE Category 4 ability, can take the lead in, meet LTE commercial background stop work letter portion, China Mobile to many the intersection of mould and terminal demand of chip in advance.

” The integration of FDD and TDD technology accords with and moves the future development trend of the communication network, helps TD-LTE to form industry’s scale effect. The focal point that China Mobile expanded scale and tested of 2012, it is ‘ many mould terminal stations ‘ which merged TD-SCDMA, TD-LTE and LTE FDD. ” Unite jade Sun, scientific and technological president of core, hope to show like this: ” Unite the core as one of the chip manufacturers participating in the scale first and testing, our TD-LTE/TD-HSPA bimodulus data card solution succeeded in entering MTnet test early at the end of last year, and make good progress while testing bimodulus technology for two stages to verify in China Mobile TD-LTE scale. Meanwhile, many model’s terminal chips rose to the height of company’s strategical planning long ago, our experience on TD-SCDMA market and innovation on many mould LTE chip schemes can let us laminate this market demand even more. ”

TD-LTE/LTE FDD/TD-HSPA/GGE many mould chips LC1761 that the core science and technology of this antithetical couplet introduces, adopt 40nm craft. Can realize down 150Mbps, the high-efficient data transmission of up 50Mbps. Support the hardware to accelerate the algorithm that ZUC grandfather washed at the same time, 3GPP Release 9, LTE Category 4, TM8, F frequency band 1.9G of LTE With outstanding ability of selecting again automatically etc., meet China Mobile TD-SCDMA TD-LTE all frequency band requirements. Especially already been regarded as one of LTE international competition standards, the password algorithm washed by the grandfather of independent design which China submits, support LTE many mould chips of this algorithm not to appear yet all the time before this. Unite the core LC1761 as first many mould chips which support algorithm of this password of industry at present, have responded to the intersection of Engineer and letter department and strategic plan of international market before coming to LTE commercial era of China Mobile to expect as soon as possible, have a positive meaning in the industry of China Mobile and industry’s development of commercial password.

LC1761 can well meet the market to the customization demand for the data terminal and holding intelligent terminal. Because of the development of this scheme, BOM will be simplified further, and will have C2C,etc. abundant interface, right with major AP to mix, can save Modem side Memory. Not only support LTE and 2/3G pair to treat pronunciation scheme also support the international major CSFB form to treat the pronunciation scheme, have on speech business complete to support, it is one that face large mould, move Internet’s terminal maturity scheme. Because of this scheme, can help the customer to realize data terminal stations such as CPE, module, Mifi, data card,etc. fast, holding terminal customization demands such as and dull and stereotyped computer, information machine, intellectual mobile phone,etc.. Meanwhile, direct against LTE diversified market demand, uniting core science and technology also introduces a pure LTE Modem chip LC1761L that only supports TD-LTE/LTE FDD this time, not only can meet pure LTE data terminal market demand, can also and employ the processor to make up many mould pair and treat LTE intelligent terminal solution with 3G intelligent terminal chip, it is worthy of meeting diversified market demand that flexible and right with various other rules. It is believed that the introduction of these two chips will promote and present LTE commercial terminal station of more economic with more abundant function price in the field of LTE greatly.

Blue microelectronics, person of Hangzhou, introduce, apply the high power factor that LED lights to defy type PWM controller

ML20 has excellent pictures that matches technology, do not need traditional color specification, stabilize the identification label, realize completely that designs liberalization in label

General view of the characteristic

White can be seen LED linear light source – facilitate the picture matching even more

Repeat the precision: 0.6mm 2

Leading manufacturer’s happy electronic science and technology Marvell of global integrated type chip solution, NASDAQ: MRVL Claim to develop new LED LED cooperatively with Cree limited company recently The union of the light was consulted and designed, the ones that further advanced among the companies cooperated continuously, popularization of large scale promoting LED to light. New A19 60 can adjust luminance the intersection of LED and light consult, design, adjust luminance deeply Cree XLamp LED and the intersection of Marvell and 88EM8183 TRIAC LED drive integrated circuit IC Combine together, OEM and ODM can offer the technological products of compatibility of the supreme intensity for existing adjusting luminance device. Design possessing the most advanced performance of adjusting luminance deeply in the trade newly, make the systematic efficiency of every watt up to 75 lumen. This design still contributes to reducing the cost of LED bulb by a wide margin, promote customer’s satisfaction to the products.

” The cooperation between Marvell and Cree contributes to the development that promotes the solid state to light. We, through coorperating and providing the complete LED solution, make OEM and ODM manufacturer put out the products with advanced technological function and performance the most to the market, ” Marvell green technological Vice President Kishore Manghnani of product division says, ” We jointly consulted and designed latest A19 light to adopt 88EM8183 of innovation of Marvell to drive IC, have solved several leftover problem

FCI, a connector and mutually contacting the leading manufacturers of the interconnected system to claim to put out PwrBlade

FCI Company, a high-speed connector and mutually contacting the leading developer of the interconnected system, has already developed SAS of new generation and stored the interface, and offer brand-new Mini-SAS HD product mix. This production line meets 6 Gb / s to 12 Gb / signal bandwidth requirement or corresponding SAS 2.1 and SAS 3.0 sector standard signal norm suggested for s. System this offer systematic than the intersection of SAS and interconnection in the past port reach port linear port density 19.01 millimetres only Larger port density of linear circuit board port reaches ports 11 millimetres .

” The lasting growth of Internet and relevant application, and offer memory demand and requirement of appropriate support for they, Mini-SAS HD product mix becomes at present and the future memory hardware framework one is interconnected and choosing first ,Especially because the board density of linear circuit that Mini-SAS HD sector standard offers, ” FCI advanced regional commercial affair is developed a manager Francis Lo and said,

” The panel connector that we designed on the basis of IMLA proves that totally accords with SAS 2.1 and SAS 3.0 sector standard suggested through measuring. This makes our customer nowadays employ and design SAS 2.1 on our panel connector products, and not sewn its system to upgrade the SAS 3.0 signal speed of getting and suggesting, two kinds of application adopt the same products part number, have prevented any design from changing, prevented the part number from changing or purchasing the products to change. ”

Mini-SAS HD products of FCI totally accord with SFF-8643 inside is employed With SFF-8644 outside is employed Trade norm.

The inside that can be offered is panel with the outside to connect the type and include 1X1 4X ,1X2 8x With 1X4 16X Dispose, in order that the customer offers choice and design the flexibility finally. The dispositions of these panel connectors can offer 4x and 8x internal and external cable assembly solution, including EEPROM communication, offer the intact terminal station to the terminal solution. The cable assembly products of FCI also include the traditional cable, there are Mini-SAS HD connectors on one end of the cable, another end is a connector system based on previous Mini-SAS. All internal cable assemblies also have increased sideband signal ability, and can be when the cable is bent into 90 degrees when connects up, the high-speed signal is not weakened. The design of Mini-SAS HD is totally compatible with PCI Express at the same time, and can use in these frameworks are employed.

Lie in external panel the intersection of connector and firm the intersection of metal and cage and metal EMI shaped to press of system shield shell fragment and cable, replace the problematic EMC elastic spacer, and offer overall 360

International solid circuit seminar ISSCC2012 held this week Have, imec and auspicious Sa electronic Corporation TSE: 6723,Hereafter referred to as ” The auspicious Sa electron ” Have introduced innovative SAR-ADC the comparison modulus converter one by one ,Promote efficiency and speed by a wide margin, face the wireless receiver which accords with the standard requirement of high bandwidth of new generation, such as LTE-advanced and new developing Wi-Fi IEEE802.11ac .

SAR ADC has with high efficiency and with small and exquisite appearance characteristics, it is extremely attractive to various wireless applications thus should build up to let. SAR ADC is a first-selected framework of those application with medium-sized resolution ratio and sampling frequency. However, accord with the high bandwidth standard of new generation such as LTE-advanced and Wi-Fi of new generation ADC that the wireless receiver need that is required is with higher speed. Such new SAR ADC framework was developed cooperatively by imec and auspicious Sa electron, had met the demand for faster small-scale low consumption ADC. ADC introduced newly is a section of ultralow consumption 1.7mW , high-resolution 11 , the whole trends, two the intersection of step and type interweave the intersection of assembly line and SAR ADC, realize record-breaking high-energy result – change the intersection of step and 10fJ each time under up to 250Msps the intersection of sample and speed. It has promoted speed and sampling frequency by a wide margin, it is order of magnitude higher than the existing advanced ADC IP module.

This was realized through the new converter framework based on that imec previous innovative ADC design, have caught the opportunity that modern advanced CMOS technology creates ingeniously. Design and adopt all dynamic circuit, in this way the consumption is presented and changed the relation with sampling frequency linearly, having realized digitization to the maximum extent, the comparator is the module of only simulation.

ADC prototype adopted 40nm CMOS craft to make, the key chip area was square 0.066 millimetre. Measure and reveal DNL the error sharply type of differential With INL the error sharply type of total mark Respectively it is 0.8 /-0.5 and 1.1 /-1.5 LSB. Dynamic performance has been shown as and realized SNDR 10.0 ENOB of 62dB under the speed of 10Msps ,But can keep the level of 9.5 ENOB under the sample speed up to 250Msps. The consumption is 6.9pJ / conversion 70